Tsum1pfr-lf Datasheet -

A: Lead-free. The device meets RoHS standards. Peak reflow temperature should not exceed 260°C. No special handling required, but soldering must use lead-free alloy.

Please note: Based on standard electronic component nomenclature, "Tsum1pfr-lf" does not match a widely published, generic component from major vendors (like Texas Instruments, ON Semi, or Diodes Inc.) as of my last knowledge update. It strongly appears to be a proprietary, custom, or internal part number—potentially from a specific OEM (e.g., a TV power supply, laptop board, or industrial controller). The "LF" suffix typically denotes "Lead-Free" or "Halogen-Free."

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| Parameter | Symbol | Min | Max | Unit | |-----------|--------|-----|-----|------| | Input Voltage | VIN | -0.3 | 6.0 | V | | Enable Voltage | VEN | -0.3 | VIN + 0.3 | V | | Output Voltage | VOUT | -0.3 | VIN + 0.3 | V | | Output Short-Circuit Duration | - | Indefinite | - | - | | Maximum Junction Temperature | Tj | -40 | +150 | °C | | Storage Temperature | Tstg | -65 | +150 | °C | | Soldering Temperature (10 sec) | - | - | 260 | °C | (Test conditions: VIN = VOUT(nom) + 1V, IOUT = 10mA, Tj = 25°C, unless noted. Typical values for an adjustable 3.3V output variant.)

Note: Always verify pin 1 marking (dot or notch orientation) from the actual component. Exceeding any value in this table may cause permanent damage to the Tsum1pfr-lf. Tsum1pfr-lf Datasheet

A: Not necessarily. Measure input and output voltage difference. If >1.5V and load is 500mA, heat is normal. Add a heatsink or reduce VIN. If temperature exceeds 125°C at the case, consider a switching regulator. 9. Conclusion The Tsum1pfr-lf datasheet , while not a mass-market published document, describes a component that fits the profile of a modern, lead-free, 1A low-dropout linear regulator. Its key strengths are low quiescent current, tight output accuracy, and integrated protection. When working with this part, prioritize thermal management, verify the actual pinout via continuity tests, and cross-reference with LDOs from Texas Instruments, Diodes Inc., or Richtek if a genuine datasheet remains elusive.

Set R2 = 100kΩ, then R1 = 212.5kΩ (use 215kΩ 1% resistor). 6. Thermal Considerations and PCB Layout Because the Tsum1pfr-lf can deliver up to 1A, thermal management is critical. Power dissipation is calculated as: A: Lead-free

| Pin No. | Symbol | Function Description | |---------|--------|----------------------| | 1 | VIN | Input voltage supply. Bypass with 1µF ceramic capacitor to GND. | | 2 | GND | Ground connection. Connected to thermal pad if present. | | 3 | EN | Enable pin. Active high (logic >1.2V). Tie to VIN if unused. | | 4 | NC / BYP | No connect or bypass capacitor pin for noise reduction. | | 5 | VOUT | Regulated output voltage. Output capacitor (1µF to 10µF) required. |